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近日，包装工程学院徐晓文副教授和林勤保研究员指导的硕士二年级学生杨青华为第一作者完成的研究论文 Non-targetedScreening for Contaminants derived from Food ContactWater-borne Coatings and Risk Assessment Based on (Q)SAR Matrix 在国际著名期刊 Food Packaging a...
2017年IEEE国际集成电源封装研讨会（2017 IEEE International Workshop On Integrated Power Packaging）
2017年 IEEE 国际集成电源封装 研讨会
2017/3/13
The first IWIPP was held in 1998 at the Congress Plaza hotel in Chicago, IL, USA; after the late 90's the conference went on a 16 year hiatus and returned to it's Chicago roots in 2015. The 2015 reviv...
Novel 107 Gb/s Bias-Feeding Photodetector OEIC for Efficient Low-Cost Photoreceiver Co-Packaging
Bias-Feeding Photodetector OEIC Efficient Low-Cost Photoreceiver
2009/7/20
A novel bias-feeding photodetector is presented, suitable for dc-coupling with post-amplifiers or DEMUX-ICs, thus greatly reducing the RF coupling losses into subsequent electronics. The receiver modu...
Novel crosslinking of high-order and multiple copper twins in adavanced microelectronics packaging
2007/7/28
期刊信息
篇名
Novel crosslinking of high-order and multiple copper twins in adavanced microelectronics packaging
语种
英文
撰写或编译
撰写
作者
W. Zhang,C. Z. Liu,D. X. Li,M. L. Sui
第一作者单位
Institute of Metal Research, C...
Compliant Press-Fit Technology Integrated Into a New Back Panel Packaging Approach
a New Back Panel Packaging Approach DIN and Reversed DIN board connectors
1983/5/25
Involving, as it does, DIN and Reversed DIN board connectors, compliant press-fit pins, round cable, flat cable, and coaxial-connectors, the Berg Backpanel System has, over the past two years, gained ...
Versatile Packaging Concept Using Thick Film Hybrids for Analog and Digital Circuits
Versatile Packaging Concept Thick Film Hybrids Analog and Digital Circuits
1982/6/26
The design parameters of a packaging concept are described, which allows the realization of a complex electronic module in a closed casing using commercially available components. These are soldered t...
A chip and wire, high density packaging approach has resulted in a low cost, large scale, high density, multi-chip package (MCP). The package includes 76 ICs, 1 resistor, and 34 capacitor chips on a 2...
IC-Quartz watches have been manufactured since the appearance of CMOS-LSI about seven years ago. Nowadays, the outside view of the quartz watch is the same as that of a mechanical watch through minimi...
Tape Automated Bonding for High Density Packaging
Tape Automated Bonding High Density Packaging
1981/1/1
High density packaging of semiconductor devices is necessary for high performance in compact electronic systems. But the assembly technology must also remain cost attractive.
Through the development ...