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To clear fundamental limits of electrical interconnection, WDM optical interconnection should be implemented in Si photonics. Challenging issues are strongly connected with temperatures in CMOS proces...
Hybrid Flip-Chip Integration of a 40 Gb/s DPSK Receiver Comprising a Balanced Photodetector on a DLI-SOI Board
Hybrid Flip-Chip Integration DPSK Receiver Comprising Balanced Photodetector DLI-SOI Board
2008/8/4
A DPSK receiver concept using flipchip hybrid integration of InP photodetectors on SOI boards with optical decoder is presented. Horizontal waveguiding enables low-cost production for high data rates.