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An important trend in the design of digital cameras is the integration of capture and processing onto a single CMOS chip. Although integrating the components of a digital camera system onto a single c...
We devised a novel flexible-format optical modulator that can optically select optimum sets of carrier numbers and modulation levels according to transmission conditions. The modulator with PLC-LN hyb...
Various photonic devices covering passive to active functions have been developed and monolithically-integrated on a silicon wire waveguide platform. Obstacles to practical applications are being elim...
A polymer-based photonic toolbox is presented, in which fiber grooves, waveguides,thin film elements and 45°mirrors can be combined for hybrid integration with active components.The toolbox provides s...
The potential evolution to Terabit Ethernet transmission and network systems will be discussed. Evolution directions and applications drivers as well as transmission, switching and routing technology ...
We present a new bulk-Si optical platform for the optical interfaces toward DRAM integration with localized SOI structure and SPE. The demonstration shows that the waveguide and coupling loss are -0.6...
Photonic integration is a key enabler for 100Gbit/sec deployments. In this talk,we will review the status of integrated components and modules for 40G and 100G, and also discuss the challenges for mov...
We describe RFC, a new capability that minimizes customer outages during software and hardware upgrades in ISP networks. RFC is being used by a large Tier-1 ISP to upgrade access routers supporting th...
IEEE 802.1AS tackles the major challenge of time synchronization when providing wireless services over EPON. We investigate it by demonstrating an optical and wireless integration prototype system wit...
A 40-Gbaud tunable transmitter module was developed for the first time by the hybrid integration of a full C-band tunable laser and an InP Mach-Zehnder modulator. Wavelength-tunable chirpless 40-Gbit/...
Recent challenges facing research and development on high-speed optical and electrical devices, and their integration for 100GbE are explained. The prospects regarding low-power-consumption technology...
Photonics and Electronics integration is considered using molecular wafer bonding of an optical SOI processed wafer on top of an electronics wafer. InP sources and Ge photodetectors are processed toge...
To clear fundamental limits of electrical interconnection, WDM optical interconnection should be implemented in Si photonics. Challenging issues are strongly connected with temperatures in CMOS proces...
Photonic integration is a key technology for emerging telecommunications architectures. We examine the drivers for next-generation systems, implications for optical components, present state of the ar...
ln the last decades the complexity of InP-based Photonic Integrated Circuits has increased by almost two orders. In this paper past and future developments in Photonic Integration will be discussed.

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